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JAF


HS-DC01

HS-DC01

Product Features
Quality certification: ISO
Place of origin: China
Price term: FOB
Currency type: USD

Description:
Chip Size 0.2-2.5mm
Bonding Accuracy ±50µm; ±30
Bonding Speed UPH >9000
Wafer Size max 8 inch
Dimension 1810(W)X1035(D)X1446(H)


 


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