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HS-DC01
Product Features
Quality certification:
ISO
Place of origin:
China
Price term:
FOB
Currency type:
USD
Description:
Chip Size 0.2-2.5mm
Bonding Accuracy ±50µm; ±30
Bonding Speed UPH >9000
Wafer Size max 8 inch
Dimension 1810(W)X1035(D)X1446(H)
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