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purpose:realize precisely cutting solar silicon material, semiconductor material(single crystal silicon, multicrystal silicon, germanium, GaAs, GaP and so on), ceramic material(LTTC and so on), glass material(quartz, optical glass, phosphate filter glass and so on), magnetism material(ferrite, TiC magnetic heading), solar energy, semiconductor packaging element(CSP?BGA?PBGA?PCB and so on).
outer diameter (mm) 50,54,56,58,60,76.2,75,80,82 ……
thickness(mm) 0.18,0.20,0.22,0.25,0.30,0.33,0.35,0.40,0.43,0.45,0.50 ……
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From: Michael (Mikco) Diamond Tool Manufacturing Co.
Posted on: 7/25/2009 12:03:11 AM
Expiring On: 1/21/2010 12:03:11 AM
Days Left: (-756 days to go!)
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| Description |
purpose:realize precisely cutting solar silicon material, semiconductor material(single crystal silicon, multicrystal silicon, germanium, GaAs, GaP and so on), ceramic material(LTTC and so on), glass material(quartz, optical glass, phosphate filter glass and so on), magnetism material(ferrite, TiC magnetic heading), solar energy, semiconductor packaging element(CSP?BGA?PBGA?PCB and so on).
outer diameter (mm) 50,54,56,58,60,76.2,75,80,82 ……
thickness(mm) 0.18,0.20,0.22,0.25,0.30,0.33,0.35,0.40,0.43,0.45,0.50 ……
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